Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
1999-11-30
2001-07-31
Abrams, Neil (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S071000, C439S266000
Reexamination Certificate
active
06267603
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates generally to electrical connectors, and more particularly, to burn-in sockets suitable for the testing of integrated circuit (“IC”) packages.
Conventional burn-in sockets typically include a plurality of terminals fitted in a corresponding plurality of terminal-receiving cavities. The terminals generally include a contact section for contacting leads from the IC packages, tail sections for electrically connecting to another electronic component, and resilient sections between the contact sections and tail sections for providing contact pressure to ensure a reliable electrical path through the terminal.
Most commonly, terminal-receiving cavities are rectangular and uni-directionally aligned. Although there are examples of such rectangular cavities having been aligned obliquely or being haphazardly unaligned, they are typically uniformly aligned parallel or perpendicular with respect to the sides of the socket housing.
Regardless of the alignment, however, it is generally desirable, due to the increased miniaturization of electrical components and the increased demand for higher speed and parallel pathways, to increase the density of terminals through the socket. Thus, it is an object of the invention to provide a burn-in socket which permits an increased density of terminals per unit area in the socket body while maintaining sufficient strength to withstand the cycled stresses of repeated engagement and disengagement with IC packages being tested sequentially.
An additional factor relevant to the quality of sockets designed for burn-in testing of integrated circuit packages is the efficiency with which they can test such packages. Thus, it is important to ensure that integrated circuit packages inserted into burn-in sockets are properly aligned within the socket packages inserted into burn-in sockets are properly aligned within the socket for testing. In particular, misaligned packages may provide faulty test readings as leads from the integrated circuit packages may not have reliable electrical pathways to the electrical testing component, such as a burn-in board. Conventional burn-in testing sockets which include apparatus for lowering an integrated circuit package into contact with the terminals thereof often have less than satisfactory means for assuring lateral position of the package and, thus, may produce unsatisfactory burn-in testing results and efficiency.
Accordingly, it is an object of the present invention to provide a burn-in socket capable of permitting the residence of terminals therein at an increased density without harming the physical strength and performance of the socket.
It is another object of the present invention to assure that each terminal has reliable contact with an appropriate lead of an inserted integrated circuit package to provide more efficient burn-in testing of integrated circuit packages.
SUMMARY OF THE INVENTION
To attain the aforementioned objects, a socket is provided for burn-in testing of an integrated circuit package having electrical leads. In one embodiment of the invention, the socket includes an outer socket housing and an inner socket housing slidably moveable relative to the outer housing between an upper limit position and a lower limit position, the inner housing for supporting the integrated circuit package thereon and having a plurality of terminal-receiving cavities therein. The socket further includes a plurality of terminals disposed in the terminal-receiving cavities of the inner housing for contacting the leads of the integrated circuit package, a cam mechanism for raising and lowering the inner housing between the upper limit position and lower limit position relative to the outer housing, and a latch mechanism for holding and releasing the integrated circuit package relative to the inner housing.
In another aspect, the socket of the invention includes an opening for insertion of the IC package, an outer socket housing, and an inner socket housing that is slidable relative to the outer housing between an upper limit position and a lower limit position. The inner housing has a plurality of terminal-receiving cavities therein, a plurality of terminals disposed in the terminal-receiving cavities of the inner housing, a cam mechanism having an actuator, and a latch mechanism having the same actuator as the cam mechanism. At least one of the cam mechanism and the latch mechanism includes a return biasing apparatus, and the latch mechanism includes a latch arm.
The unique lattice arrangement of terminal-receiving cavities and terminals permits increased terminal density without compromising the strength and physical performance characteristic of the test socket. Furthermore, the unique interaction of the cam mechanism and latch mechanism relative to the timing of the insertion/removal of the integrated circuit and the relative gentle and steep sloped portions of the interaction between the cam surface and cam follower surface provide a reliable socket and method for burn-in testing of integrated circuits, wherein the risk of fallen or dislocated integrated circuits is minimized.
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Patent Abstract of Japan, vol. 97, No. 10, No. 09162332 Oct. 31, 1997.
Kaneshige Akira
Nakano Tomohiro
Yamamoto Isamu
Abrams Neil
Cohen Charles S.
Molex Incorporated
Paulius Thomas D.
Zarroli Michael C.
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