Burn-in substrate for semiconductor devices

Details Burn-in substrate for semiconductor devices Burn-in substrate for semiconductor devices

2007-04-03

2007-04-03

Nguyen, Vinh P. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010, C324S755090

Reexamination Certificate

active

10975015

ABSTRACT:
Input and output of small-current signals between a mother board and semiconductor devices subjected to a burn-in test are made via a device driving unit. Large-current main power is supplied via the device driving unit through bus bars without passing through the mother board. In this way, the risk of burn-out in a burn-in substrate and burn-in sockets, and damages caused by a burn-out can be reduced even when it occurs.

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patent: 04-118984 (1992-04-01), None
patent: 09-068557 (1997-03-01), None
patent: 2000-221234 (2000-08-01), None
patent: 3392783 (2001-01-01), None

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