Burn-in sockets for BGA IC devices having an integrated...

Electrical connectors – Coupling part with actuating means urging contact to move...

Reexamination Certificate

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Reexamination Certificate

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07318736

ABSTRACT:
A slider24that integrates adaptor alignment and anti-stick features is shown for use in a socket for mounting BGA type IC devices for burn-in tests. Slider24has a top wall surface14bformed with a plurality of apertures in a grid array defined by intersecting ribs14e,14f. A plurality of wall extension portions14hare formed extending upwardly from portions of x-direction ribs that serve as fine alignment features with an IC device2adapted to be placed on the flat top end surface of the wall extension portions between rows of IC device solder ball terminals2a. Anti-stick fingers24cextend in the x-direction from wall extension portions24balong a y-direction rib defining the outer limit of the first column14sof apertures of the main grid. A concave surface24dis formed in each finger facing wall portions24band the height of wall portions24bis limited to a location below the position of solder balls of an IC device mounted in the socket to provide clearance for a mechanical support ball positioned in the first column of apertures next to wall extension portion24boutside the main grid field to provide full grid array capability.

REFERENCES:
patent: 6402537 (2002-06-01), Ikeya
patent: 6614247 (2003-09-01), Ikeya et al.
patent: 2006/0046531 (2006-03-01), Sinclair
patent: 2006/0205256 (2006-09-01), Hoppe
patent: 2006/0228926 (2006-10-01), Sato et al.
patent: 2006/0246758 (2006-11-01), Sinclair
patent: 2007/0004261 (2007-01-01), Hayakawa

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