Burn-in socket for zig-zag inline semiconductor package

Details Burn-in socket for zig-zag inline semiconductor package Burn-in socket for zig-zag inline semiconductor package

1987-05-06

1988-12-13

McGlynn, Joseph H.

Electrical connectors

Metallic connector or contact having movable or resilient...

Spring actuated or resilient securing part

H01R 1311

Patent

active

047907797

ABSTRACT:
A burn-in socket for a zig-zag inline package includes an insulative housing carrying a plurality of electrical terminals which include convexly formed sections defining contact portions. The apices of the convexly formed sections are laterally offset to increase the amount of deflection obtainable from any given thickness of package lead. The convexly formed sections are axially offset to stagger the insertion force and the terminals are designed to plastically deform under certain conditions to limit the normal force between the contacts and the package leads.

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patent: 4607907 (1986-08-01), Bogiursky
Addendum FIGS. 1-6, Advertisement: Connection Technology--Nov. '86, p. 62.

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