Burn-in socket

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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Details

439266, 439331, H01R 1362

Patent

active

053760107

ABSTRACT:
A burn-in socket for land grid array devices or ball grid array devices includes a receptacle having an array of terminals for accepting and contacting the device and an outer shell which is actuated by rotation of the shell to capture the device and provide a force to ensure electrical contact between the device and the terminals.

REFERENCES:
patent: 4376560 (1983-03-01), Olsson et al.
patent: 4396935 (1983-08-01), Schuck
patent: 4715823 (1987-12-01), Ezura et al.
patent: 4758176 (1988-07-01), Abe et al.
patent: 4768973 (1988-09-01), Bakermans
patent: 4801273 (1989-01-01), Ikeya et al.
patent: 4832612 (1989-05-01), Grabbe et al.
patent: 4846704 (1989-07-01), Ikeya
patent: 4923404 (1990-05-01), Redmond et al.
patent: 4950980 (1990-08-01), Pfaff
patent: 4969828 (1990-11-01), Bright et al.
patent: 4986760 (1991-01-01), Petersen et al.
patent: 5057031 (1991-10-01), Sinclair
patent: 5068601 (1991-11-01), Parmenter
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5123855 (1992-06-01), Petersen
patent: 5199890 (1993-04-01), Kubo
patent: 5234349 (1993-08-01), Matsuoka et al.

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