Heat exchange – With timer – programmer – time delay – or condition responsive... – Having heating and cooling capability
Reexamination Certificate
2006-10-03
2006-10-03
Ciric, Ljiljana (Department: 3753)
Heat exchange
With timer, programmer, time delay, or condition responsive...
Having heating and cooling capability
C165S080400, C438S014000, C324S760020, C324S765010
Reexamination Certificate
active
07114556
ABSTRACT:
A heat exchange system that can accommodate a high power integrated circuit chip for burn-in temperature stressing includes a heat sink having a chip engaging surface that is adapted to engage a surface of the chip. A liquid layer fills a heat exchange gap between the surface of the chip and the chip engaging surface of the heat sink. The liquid layer provides a low thermal resistance juncture between the chip engaging surface of the heat sink and the surface of the chip, which allows for greater heat transfer therebetween.
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Japanese-to English translation of te claims and the detailed description of JP 06-101947, Feb. 21, 2006.
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Office Communication for Application No. 10/669,736 filed Sep. 24, 2003, date of mailing Oct. 14, 2005.
Hamilton Harold E.
Tremmel Tom A.
Ciric Ljiljana
Micro Control Company
Westman Champlin & Kelly
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