Buried resist technique for the fabrication of printed wiring

Details Buried resist technique for the fabrication of printed wiring Buried resist technique for the fabrication of printed wiring

1980-06-09

1982-01-26

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

156664, 156666, 156901, 156902, 427 97, 204 15, 430318, 430319, H05K 342, H05K 318

Patent

active

043128971

ABSTRACT:
Narrow conductors and narrow spaces therebetween, typically two or three mils wide, are fabricated on outer layers of a printed wiring board with built-up areas such as plated-through holes or conductors of widths greater than two or three mils. Gold is deposited over a copper clad substrate in a pattern defining the desired circuitry. Thereafter, solder is placed at the built-up areas and, using both the solder and the gold as resist or masks, the exposed copper is removed by etching. An organic resist material is used in lieu of solder when the built-up area comprises wide conductors or leads, e.g., power busses.

REFERENCES:
patent: 3236708 (1966-02-01), Tillis
patent: 3306830 (1967-02-01), Bittrich et al.
patent: 3475284 (1969-10-01), Olson
patent: 3673680 (1972-07-01), Tanaka et al.
patent: 3986939 (1976-10-01), Prest
patent: 4135988 (1979-01-01), Dugan et al.

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