Buried power buss utilized as a ground strap for high...

Details Buried power buss utilized as a ground strap for high... Buried power buss utilized as a ground strap for high...

2005-04-19

2005-04-19

Nhu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

Reexamination Certificate

active

06882053

ABSTRACT:
A method and system for providing a ground strap on a semiconductor device is disclosed. The method and system comprises providing a substrate region and providing an epitaxial (EPI) layer over the substrate region. The method and system includes etching a plurality of device structures in the EPI layer and providing a slot in the semiconductor substrate that is in contact with the substrate region. Finally, the method and system includes oxidizing the slot except at the bottom of the slot and providing a metal within the slot.

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