Buried junction infrared photodetector process

Details Buried junction infrared photodetector process Buried junction infrared photodetector process

1988-04-07

1990-09-11

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 3, 437185, 437228, 437904, 437 22, H01L 2110, H01L 21329

Patent

active

049563041

ABSTRACT:
An array of photodiodes is comprised of a Group II-VI material, such as HgCdTe, which is processed to form a plurality of diode junctions. The array is fabricated by a method which comprises a first step of providing a radiation absorbing base 12 of p-type Hg.sub.(1-x) Cd.sub.x Te material. Each of the photodiodes is fabricated by depositing a layer 18 of wider bandgap passivation material over the substrate, depositing a photomask layer 26 over the passivation layer and selectively removing the passivation layer through openings within the photomask layer. One method of removing the passivation layer 18 is by ion milling which also converts the underlying p-type substrate material to n-type material. The lattice damage caused by the ion milling extends laterally outward such that the n-type region 14, and associated p-n diode junction 16, is disposed beneath the passivation layer 18. Alternatively, the substrate material is converted to an opposite type of conductivity by depositing a layer of source material followed by a diffusion process.

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