Bundling apparatus

Package making – With cover-adjunct application or formation – By printing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

53376, 53588, 100 33PB, B65B 6100

Patent

active

045397899

ABSTRACT:
In a bundling apparatus, a main clamping mechanism presses a stack of paper sheets in the direction of thickness of the stack and holds the stack. A band is wound by a winder around the stack of paper sheets held by the main clamping mechanism. The end portions of the band wound around the stack of paper sheets are bonded by a heat-bonding mechanism. Specified data is stamped on the band wound around the stack by a data-stamping mechanism which includes a stamp bearing the specified data and a drive mechanism for bringing the stamp into contact with the band while the end portions of the band are being bonded to each other.

REFERENCES:
patent: 1235312 (1917-07-01), Hadert
patent: 3884015 (1975-05-01), Melton
patent: 4111116 (1978-09-01), Ito et al.
patent: 4117650 (1978-10-01), Ito et al.
patent: 4155213 (1979-05-01), Blanton et al.
patent: 4363692 (1982-12-01), Imamura et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bundling apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bundling apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bundling apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1420887

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.