Bundle of long thin carbon structures, manufacturing method...

Details Bundle of long thin carbon structures, manufacturing method... Bundle of long thin carbon structures, manufacturing method...

2007-12-03

2011-12-06

Sample, David (Department: 1783)

Stock material or miscellaneous articles

Self-sustaining carbon mass or layer with impregnant or...

C423S447100

Reexamination Certificate

active

08071216

ABSTRACT:
In the bundle of long thin carbon structures of the present invention, end parts of the bundle are interconnected in a carbon network. The interconnected end parts form a flat surface. By this, an electrical connection structure with low resistance and/or a thermal connection structure with high thermal conductivity are obtained. The bundle of long thin carbon structures can be used suitably as a via, heat removal bump or other electronic element.

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patent: 2006-229297 (2006-08-01), None
T. Iwai et al, “Thermal and Source Bumps utilizing Carbon Nanotubes for Flip-chip High Power Amplifiers,” IEEE IEDM, Technical Digest, 2005, pp. 257-260.
Mizuhisa Nihei et al, “Electrical Properties of Carbon Nanotube Bindles for Future Via Interconnects,” Japanese Journal of Applied Physics; vol. 44; No. 4A; 2005; pp. 1626-1628.
Mizuhisa Nihei et al, “Simultaneous Formation of Multiwall Carbon Nanotubes and their End-Bonded Ohmic Contacts to Ti Electrodes for Future ULSI Interconnects,” Japanese Journal of Applied Physics; vol. 43; No. 4B; 2004; pp. 1856-1859.

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