Bumps with plural under-bump dielectric layers

Details Bumps with plural under-bump dielectric layers Bumps with plural under-bump dielectric layers

1998-01-14

2000-12-26

Gaffin, Jeffrey

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

438613, 361768, 174267, 174260, 29840, 29846, H05K 103

Patent

active

061663336

ABSTRACT:
The present invention includes composite support substrate for both flexible and rigid board circuit applications and method of making the same. The composite substrate is composed of at least two materials formed under the circuitry. A first material is a conventional matrix such as a polyimide/acrylic adhesive, and a second material having unique properties that are useful locally in isolated locations. For instance, the second material may be nonporous to moisture, optically clear, and/or thermally conductive. The second material is integrated into the circuit matrix at specific localized areas where desired with portions coplanar with the first material so that circuit traces remain continuous as they pass from the first material to the second. For example, an integrated circuit chip may be isolated from the polyimide matrix, which is porous in moisture, by using the second material that is nonporous to moisture at locations where the integrated circuit chip is to be attached, thus isolating the integrated circuit chip from the polyimide and preventing moisture from flowing through to the chip.

REFERENCES:
patent: 4851615 (1989-07-01), Butt
patent: 5207887 (1993-05-01), Crumly et al.
patent: 5245135 (1993-09-01), Schreiber et al.
patent: 5245750 (1993-09-01), Crumly et al.
patent: 5451722 (1995-09-01), Gregoire
patent: 5790377 (1998-08-01), Schreiber et al.
patent: 5937512 (1999-08-01), Lake et al.
patent: 6085414 (2000-07-01), Swarbrick et al.

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