Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-07-14
2009-12-29
Monbleau, Davienne (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S781000, C257SE23015
Reexamination Certificate
active
07638876
ABSTRACT:
When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads2on the surface thereof and with a passivation film3at the periphery of the electrode pads2, and conductive particles4are metallically bonded to the electric pads2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles4. This bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.
REFERENCES:
patent: 4618739 (1986-10-01), Theobald
patent: 5034245 (1991-07-01), Matsubara
patent: 5420520 (1995-05-01), Anschel et al.
patent: 5894165 (1999-04-01), Ma et al.
patent: 6080264 (2000-06-01), Ball
patent: 6223429 (2001-05-01), Kaneda et al.
patent: 0 413 335 (1991-02-01), None
patent: 0 951 064 (1999-10-01), None
patent: A-54-152470 (1979-11-01), None
patent: A-3-27542 (1991-02-01), None
patent: A-03-185894 (1991-08-01), None
patent: A-04-079397 (1992-03-01), None
patent: A-4-79397 (1992-03-01), None
patent: A-05-047839 (1993-02-01), None
patent: A-5-47839 (1993-02-01), None
patent: A-5-110243 (1993-04-01), None
patent: A-7-37890 (1995-02-01), None
Hishinuma Hiroyuki
Nakamura Masayuki
Yamada Yukio
Monbleau Davienne
Oliff & Berridg,e PLC
Sony Chemical & Information Device Corporation
Trinh Hoa B
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