Bumpless bonding process having multilayer metallization

Details Bumpless bonding process having multilayer metallization Bumpless bonding process having multilayer metallization

1993-03-10

1993-10-05

Heinrich, Samuel M.

Metal fusion bonding

Process

Using high frequency vibratory energy

228208, 437194, 437197, H01L 21607

Patent

active

052497283

ABSTRACT:
A method of electrically connecting a tape automated bonding lead to an aluminum input/output pad of an integrated circuit includes sequentially sputtering an adhesive layer, a diffusion barrier layer and a gold layer on the input/output pad. The adhesive layer is a metallic film having good step coverage and adhesive properties to contact the pad. The diffusion barrier layer is formed atop the adhesive layer and is sandwiched by the gold layer. The method employs "bumpless" techniques and the bond lead is connected to the gold layer by applying a combination of pressure and vibrational energy.

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patent: 4893742 (1990-01-01), Bullock
patent: 4917286 (1990-04-01), Pollacek
patent: 4927505 (1990-05-01), Sharma et al.
patent: 4950866 (1990-08-01), Kojima et al.
patent: 5110034 (1992-05-01), Simmonds

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