Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2008-04-18
2009-06-09
Lee, Calvin (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C438S614000
Reexamination Certificate
active
07545038
ABSTRACT:
A bumping process comprises forming a passivation layer having a planarized surface covering a pad on a substrate, forming a hole penetrating through the passivation layer to expose a contact surface of the pad, and forming a bump on the contact surface and planarized surface. The planarized surface will provide a larger effective area for pressing, thereby minimizing the pad, enhancing the mechanical strength at the peripheral of the pad, providing more selection flexibility for anisotropic conductive film, reducing the possibilities of short circuit and current leakage within the bump gap, and increasing the yield of the pressing process and the conductive quality of the bump.
REFERENCES:
patent: 6372619 (2002-04-01), Huang et al.
patent: 6479376 (2002-11-01), Huang et al.
patent: 7282433 (2007-10-01), Tang et al.
Chen Cheng-Chung
Hu Chun-Ping
Lee Yu-Ching
Tsi Chien-Wen
Elan Microelectronics Corporation
Lee Calvin
Rosenberg , Klein & Lee
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