Bumping electronic components using transfer substrates

Details Bumping electronic components using transfer substrates Bumping electronic components using transfer substrates

2007-10-26

2010-10-26

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

C228S039000, C228S049500, C228S180220

Reexamination Certificate

active

07819301

ABSTRACT:
A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of silicone rubber having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.

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