Bumped semiconductor device and method for probing the same

Details Bumped semiconductor device and method for probing the same Bumped semiconductor device and method for probing the same

1994-07-05

1996-09-10

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

3241581, G01R 3126

Patent

active

055549403

ABSTRACT:
Probing array bumped semiconductor devices using cantilever probe needles is facilitated by the formation of peripheral test pads. A semiconductor die (10) includes bond pads (12). A redistribution metallization layer is deposited and patterned to form individual redistribution structures (26) associated with and electrically coupled to each bond pad. Each redistribution structure includes a test pad (28), a bump pad (30) and a bump pad interconnect (32). The test pads are formed in positions close to those of the underlying bond pads, while the bump pads can be formed anywhere within the die. Having the test pads located similarly to the bond pads enables the same or a similar probe card apparatus and cantilever needles (50) to probe the die either at the bond pads for devices which are to be wire bonded or TAB bonded, or at the test pads for devices which are to be bumped.

REFERENCES:
patent: 3795973 (1974-03-01), Calhoun
patent: 5008727 (1991-04-01), Katsura et al.
patent: 5089772 (1992-02-01), Hatada et al.
patent: 5187020 (1993-02-01), Kwon et al.
patent: 5241266 (1993-08-01), Ahmad et al.
patent: 5307010 (1994-04-01), Chiu
"Motorola C4 Product Design Manual;" vol. 1: Chip and Wafer Design; ch. 1 (Tech. Overview), pp. 1--1 -1-20, and ch. 9 (Wafer Probling), pp. 9-1-9-14 (1993). (month unavailable).

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