Bumped die and wire bonded board-on-chip package

Details Bumped die and wire bonded board-on-chip package Bumped die and wire bonded board-on-chip package

2006-09-20

2009-12-08

Nguyen, Dao H (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S777000, C257S778000, C257S786000, C257SE21053, C257SE23040, C257SE23063, C438S613000

Reexamination Certificate

active

07629686

ABSTRACT:
An apparatus for making a semiconductor assembly and, specifically, interconnecting a semiconductor die to a carrier substrate. The carrier substrate includes a first surface and a second surface with at least one opening therethrough. The die includes an active surface and a back surface, wherein the die is attached face down to the first surface of the carrier substrate with conductive bumps therebetween. In addition, a plurality of bond wires is attached through the at least one opening in the carrier substrate between the active surface of the die and the second surface of the carrier substrate. With this arrangement, both the conductive bumps and the bond wires share in the electrical interconnection between the die and the carrier substrate, thereby allowing more space for bond pads to interconnect with bond wires and/or allowing for smaller die sizes.

REFERENCES:
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 4940181 (1990-07-01), Juskey, Jr. et al.
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5329423 (1994-07-01), Scholz
patent: 5410181 (1995-04-01), Zollo et al.
patent: 5477086 (1995-12-01), Rostoker et al.
patent: 5534467 (1996-07-01), Rostoker
patent: 5598031 (1997-01-01), Groover et al.
patent: 5674785 (1997-10-01), Akram
patent: 5719440 (1998-02-01), Moden
patent: 5744383 (1998-04-01), Fritz
patent: 5777391 (1998-07-01), Nakamura et al.
patent: 5811879 (1998-09-01), Akram
patent: 5891753 (1999-04-01), Akram
patent: 5917242 (1999-06-01), Ball
patent: 5936305 (1999-08-01), Akram
patent: 5973403 (1999-10-01), Wark
patent: 5990565 (1999-11-01), Chang
patent: 6011307 (2000-01-01), Jiang et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6081037 (2000-06-01), Lee et al.
patent: 6133626 (2000-10-01), Hawke et al.
patent: 6144101 (2000-11-01), Akram
patent: 6157086 (2000-12-01), Weber
patent: 6218731 (2001-04-01), Huang et al.
patent: 6228679 (2001-05-01), Chiu
patent: 6265766 (2001-07-01), Moden
patent: 6294838 (2001-09-01), Peng
patent: 6528408 (2003-03-01), Kinsman
patent: 6630730 (2003-10-01), Grigg
patent: 6744137 (2004-06-01), Kinsman
patent: 7115990 (2006-10-01), Kinsman
patent: 7116001 (2006-10-01), Kinsman

Affiliated with

Also associated with

Rating

Bumped die and wire bonded board-on-chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bumped die and wire bonded board-on-chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bumped die and wire bonded board-on-chip package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4137786