Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2007-03-30
2011-10-04
Garber, Charles (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257SE23019, C257SE23020, C257SE23021, C257SE23022
Reexamination Certificate
active
08030767
ABSTRACT:
A bump structure with an annular support suitable for being disposed on a substrate is provided. The substrate has at least one pad and a passivation layer that has at least one opening exposing a portion of the pad. The bump structure with the annular support includes an under ball metal (UBM) layer, a bump, and an annular support. The UBM layer is disposed on the passivation layer and covers the pad exposed by the passivation layer. The bump is disposed on the UBM layer over the pad, and a diameter of a lower surface of the bump is less than the diameter of an upper surface thereof. The annular support surrounds and contacts the bump, and a material of the annular support is photoresist. An under cut effect is not apt to happen on the bump structure.
REFERENCES:
patent: 4742033 (1988-05-01), Harris et al.
patent: 5268072 (1993-12-01), Agarwala et al.
patent: 5310699 (1994-05-01), Chikawa et al.
patent: 5492235 (1996-02-01), Crafts et al.
patent: 5550427 (1996-08-01), Hayashi
patent: 5838067 (1998-11-01), Baek
patent: 5844314 (1998-12-01), Kim
patent: 5872404 (1999-02-01), Lynch et al.
patent: 6602775 (2003-08-01), Chen et al.
patent: 6622907 (2003-09-01), Fanti et al.
patent: 6696356 (2004-02-01), Tseng et al.
patent: 6740427 (2004-05-01), Datta et al.
patent: 6756294 (2004-06-01), Chen et al.
patent: 6902997 (2005-06-01), Ho et al.
patent: 6930031 (2005-08-01), Huang
patent: 7262078 (2007-08-01), Lai et al.
patent: 7358174 (2008-04-01), Mis
patent: 2002/0000673 (2002-01-01), Farnworth
patent: 2004/0229474 (2004-11-01), Tsai et al.
patent: 2006/0068595 (2006-03-01), Seliger et al.
patent: 2006/0076677 (2006-04-01), Daubenspeck et al.
patent: 2007/0087544 (2007-04-01), Chang et al.
patent: 2008/0185716 (2008-08-01), Huang
“1st Office Action of China counterpart application”, issued on Dec. 26, 2008, p. 1-p. 4.
ChipMOS Technologies (Bermuda) Ltd.
Garber Charles
Jianq Chyun IP Office
Sene Pape
LandOfFree
Bump structure with annular support does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bump structure with annular support, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bump structure with annular support will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4285880