Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2006-04-25
2006-04-25
Kang, Donghee (Department: 2811)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S030000, C428S323000, C430S321000, C430S325000, C430S326000, C430S330000
Reexamination Certificate
active
07033851
ABSTRACT:
A method for manufacturing a bump structure includes depositing a layer of photosensitive material on a substrate. Next, multiple strip-shaped shielding sections are arranged on an optical mask at intervals and multiple irregularly arranged circular holes are distributed in the respective strip-shaped shielding sections. Multiple irregularly arranged circular shielding sections are distributed in spacing sections between the adjacent strip-shaped shielding sections and multiple irregularly arranged arch notches and arch shielding sections are distributed on the edges of the strip-shaped shielding sections. The photosensitive material layer is then exposed and developed to form bumps thereon and the heat is applied to solidify the surface of the bumps. Then a reflective film is laid on the substrate and the bumps to form a reflective board.
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Kang Donghee
Rosenberg , Klein & Lee
Wintek Corporation
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