Bump printing apparatus

Details Bump printing apparatus Bump printing apparatus

2009-10-07

2010-12-07

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

C228S041000, C228S044700, C228S049500

Reexamination Certificate

active

07845539

ABSTRACT:
There is provided a bump printing apparatus that can improve the printability of solder bumps printed on a board. The bump printing apparatus may include a printing table onto which a board is mounted; a mask making close contact with the board and printing solder bumps on the board by separating the mask from the board after a printing operation; and mask tables extending from the printing table to edges of the mask and sucking the edges of the mask to bring the edges of the mask into close contact with the board under vacuum.

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