Semiconductor device manufacturing: process – Including control responsive to sensed condition – Optical characteristic sensed
Patent
1998-02-20
2000-10-17
Dutton, Brian
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Optical characteristic sensed
438 16, H01L 2100, H01L 2166, G01R 3126
Patent
active
061330523
ABSTRACT:
A measurement window 29 is set in a bump formation position found from the bump formation co-ordinates of bonding data in respect of an image that has been picked up of the external appearance of a stud bump 23 at an inspection position. The image in this measurement window 29 is converted to respective binary images based on binary conversion levels which are respectively individually set for measurement of bump pedestal 24 and for bump head 27. Of image grains constituted by continuous areas of the same image level in the binary image, an image grain having maximum area is extracted and the position, shape and dimensions of the bump pedestal 24 and bump head 27 are then respectively measured using respectively a hole-filled image and the hole portion of this extracted image grain. The quality and presence of a stud bump 23 are determined by comparing the measured values with set values.
REFERENCES:
patent: 5058178 (1991-10-01), Ray
patent: 5306664 (1994-04-01), Sakura
patent: 5761337 (1998-06-01), Nishimura et al.
Dutton Brian
Matsushita Electric - Industrial Co., Ltd.
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