Bump forming method and bump forming apparatus

Details Bump forming method and bump forming apparatus Bump forming method and bump forming apparatus

2011-03-15

2011-03-15

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S746000, C029S842000, C029S846000, C174S259000, C438S108000

Reexamination Certificate

active

07905011

ABSTRACT:
In a method for forming bumps19on electrodes32of a wiring board31, a fluid14containing conductive particles16and a gas bubble generating agent is supplied onto a first region17including the electrodes32on the wiring board31. Then, a substrate40which has a protruding surface13having the same area as that of the first region17and formed on a main surface18of the substrate40having a larger area than that of the first region17is disposed so that the protruding surface13faces the first region17of the wiring board31. Then, the fluid14is heated to generate gas bubbles30from the gas bubble generating agent contained in the fluid14.

REFERENCES:
patent: 7640659 (2010-01-01), Karashima et al.
patent: 2006/0163744 (2006-07-01), Vanheusden et al.
patent: 2007/0096062 (2007-05-01), Kodas et al.
patent: 2009/0078746 (2009-03-01), Karashima et al.
patent: 2009/0133901 (2009-05-01), Karashima et al.
patent: 2009/0203170 (2009-08-01), Nakatani et al.
patent: 2009/0229120 (2009-09-01), Taniguchi et al.
patent: 1-157796 (1989-06-01), None
patent: 6-125169 (1994-05-01), None
patent: 7-74459 (1995-03-01), None
patent: 2000-94179 (2000-04-01), None
patent: 2002-26070 (2002-01-01), None
patent: 2002-223065 (2002-09-01), None
patent: 2004-260131 (2004-09-01), None
patent: WO 2005/122237 (2005-12-01), None
patent: WO 2006/025387 (2006-03-01), None
Rito, M., et al., “Assembly Process by Electrically Conductive Adhesive Using Low Melting Point Fillers”, 9th Symposium on “Microjoining and Assembly Technology in Electronics”, Feb. 6-7, 2003, p. 115-120, Yokohama, Japan.
Yasuda, M., et al., “Self-Organized Joining Assembly Process by Electrically Conductive Adhesive Using Low Melting Point Fillers”, 10th Symposium on “Microjoining and Assembly Technology in Electronics”, Feb. 5-6, 2004, p. 183-188, Yokohama, Japan.
Yasuda, K., et al., “Self-Organized Packaging using Polymer Containing Low-Melting-Point-Metal Filler -Process Simulation of Viscous Multi Phase Flow Fluid-” 11th Symposium on “Microjoining and Assembly Technology in Electronics”, Feb. 3-4, 2005, p. 239-244, Yokohama, Japan.
Yamada, T., et al., “Self-organized Packaging by Polymer Containing Low Melting Point Metal -Experimental Verification of Process Rule Factors of Self-organization-”, 11th Symposium on “Microjoining and Assembly Technology in Electronics” Feb. 3-4, 2005, p. 245-250, Yokohama, Japan.

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