Bump forming method

Details Bump forming method Bump forming method

1992-02-14

1993-11-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

228 11, 228 45, 2281791, 437183, H01R 906

Patent

active

052632466

ABSTRACT:
In order to minimize the size of an aluminum pad in a method of forming a bump, a metal wire is wedge-bonded on the aluminum pad, a necessary amount of the wire is left on the aluminum pad, and the metal wire is disconnected by a clamp. The width of a collapsed portion of the wire on the aluminum pad can be reduced to 1.5 times or less the wire diameter.

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