Bump forming apparatus

Metal fusion bonding – With means to cut or separate work – filler – flux – or product – Plus means to apply cut filler or cut flux to work

Patent

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Details

228 13, 228 41, B23K 2002, B23K 2802

Patent

active

055731708

ABSTRACT:
In an apparatus for punching a metallic sheet to stamp out a bump and bonding it to a substrate, an AuSn sheet is heated to above a softening point thereof by a heater. A solenoid is energized to cause a punch and a die to stamp out a bump from the AuSn sheet. The bump is directly bonded to a substrate. The punch is made up of a shank portion and a punch portion. A punch holder for guiding the shank portion and punch portion with high accuracy molded integrally with the die. The punch is connected to the solenoid with the intermediary of a damper spring. When the bump hits against the substrate, the damper spring prevents it from chipping off or cracking due to an impact. Subsequently, another solenoid is energized to move the punch further downward, thereby pressing the bump against the substrate for a sufficient period of time.

REFERENCES:
patent: 3958476 (1976-05-01), Bartha
patent: 4341137 (1982-07-01), Leitch et al.
patent: 5269213 (1993-12-01), Coneski et al.
patent: 5445057 (1995-08-01), Fujita

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