Bump formation on yielded semiconductor dies

Details Bump formation on yielded semiconductor dies Bump formation on yielded semiconductor dies

1994-12-09

1996-12-24

Quach, T. N.

Fishing, trapping, and vermin destroying

437190, 437192, H01L 21283

Patent

active

055873367

ABSTRACT:
The ball bump structure of the subject invention provides a hermetically sealed bond pad at the surface of a semiconductor chip. An adhesion pad is formed at the surface of the bond pad. The adhesion pad includes a barrier layer, preferably a titanium/tungsten alloy, and a bonding layer, for example, a sputtered gold layer. A gold ball bump is formed on the adhesion pad. Methods for forming the improved structure herein are also disclosed.

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Liu, T. S., et al., A Review of Wafer Buming for Tape Automated Bonding, Solid State Tech. (Mar. 1980) pp. 71-76.
Bonkohara, M., et al., Utilization of Inner Lead Bonding Using Ball Bump Technology, ITAB '92 Proceedings pp. 86-96.

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