Bump electrode with adjacent pad and insulation for solder flow

Details Bump electrode with adjacent pad and insulation for solder flow Bump electrode with adjacent pad and insulation for solder flow

1996-05-28

2000-11-07

Gaffin, Jeffrey

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361768, 174260, H01R 909

Patent

active

061439916

ABSTRACT:
A connection electrode structure includes a wiring conductor layer formed on a printed wiring board, a bump electrode portion formed on an outer end portion of the wiring conductor layer and formed by an electroplating of Cu, a pad electrode portion formed inwardly adjacent to the bump electrode portion and continuous with it, a Ni/Au layer covering the bump electrode portion and the pad electrode portion, and a solder resist layer formed on a portion of the wiring conductor layer at an inside of the pad electrode portion to stop solder flow.

REFERENCES:
patent: 3780352 (1973-12-01), Redwanz
patent: 5245750 (1993-09-01), Crumly et al.
patent: 5279711 (1994-01-01), Frankeny et al.
patent: 5345365 (1994-09-01), Herndon et al.
patent: 5432679 (1995-07-01), Grabbe
patent: 5438478 (1995-08-01), Kondo et al.
patent: 5467253 (1995-11-01), Heckman et al.
patent: 5523920 (1996-06-01), Machuga et al.
patent: 5790377 (1998-08-01), Schreiber et al.
patent: 5864946 (1999-02-01), Eldridge et al.

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