Bump electrode, semiconductor integrated circuit device using th

Details Bump electrode, semiconductor integrated circuit device using th Bump electrode, semiconductor integrated circuit device using th

1994-07-25

1997-09-09

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361705, 439 66, 439 91, H05K 720

Patent

active

056662700

ABSTRACT:
A bump electrode includes a core portion provided on an intermediate electrode layer formed on an electrode pad formed on a surface of an element. The core portion contains a material having a Young's modulus less than that of soldering. An electrically conductive film covers the core portion.

REFERENCES:
patent: 4999460 (1991-03-01), Sugiyama et al.
patent: 5001302 (1991-03-01), Atsumi
Ward, "Pressure Contact Type Chip Join Technique", IBM Tech. Disclosure Bulletin, vol. 18, No. 9, Feb. 1976, p. 2817.

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