Bump attachment method

Details Bump attachment method Bump attachment method

1991-01-03

1992-04-21

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

228 563, B23K 3102

Patent

active

051060116

ABSTRACT:
In a method for bonding bumps to leads by pressing leads installed on a carrier tape against bumps formed on a substrate, corresponding lead-bump pairs are individually bonded; particularly, one lead on the carrier and one bump on the substrate are first aligned, and then other pairs of leads and bumps are successively and individually bonded, thus performing a secure and uniform bonding action without necessity of alterations to the bumps.

REFERENCES:
patent: 3472365 (1969-10-01), Tiedma
patent: 4142662 (1979-03-01), Holbrook et al.
patent: 4832255 (1989-05-01), Bickford et al.
patent: 4892245 (1990-01-01), Dunaway et al.

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