Bump and method of forming bump

Details Bump and method of forming bump Bump and method of forming bump

2006-08-01

2006-08-01

Karlsen, Ernest (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090, C324S757020

Reexamination Certificate

active

07084657

ABSTRACT:
A probe card used for establishing electric contact with an electric part to inspect an electric characteristic thereof comprises a plurality of conductors, each transmitting a signal used for inspection, and a plurality of bumps, each formed on one of the plurality of conductors, which are used for establishing mechanical contact with the electric part. Each bump includes a lower portion fusedly arranged on the conductor and an upper portion taperedly formed in such a fashion that a cross section of the bump closer to a tip thereof is smaller.

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German Office Action, Application No. 199 24 239.9-34, dated Dec. 20, 2005 (3 pages).

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