Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Patent
1996-08-19
1998-06-23
Ledynh, Bot L.
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
361818, 361800, 174 35R, H05K 900
Patent
active
057708223
ABSTRACT:
An EMI bulk head gasket assembly includes a bulk head and a gasket adapted to snap fit together. The bulk head includes a base plate and first and second bulk head side walls, positioned at right angles to the bulk head base plate. The first bulk head side wall includes a plurality of bulk head apertures. The gasket includes a base plate and first and second gasket side walls wherein the first gasket side wall forms an angle slightly greater than ninety degrees with the gasket base plate. The gasket is adapted to snap fit between the first and second bulk head side walls. The first gasket side wall includes inwardly pointing tabs positioned and adapted to fit into the plurality of bulk head apertures. The tabs retain the gasket between the first and second bulk head side walls. The gasket includes spring fingers each of which include a spring bend between a proximal spring finger section and a distal spring finger section. The spring finger is spring loaded by the spring bend. An inner fold over bend in the distal spring finger section has a fold over angle of 180 degrees to round the distal edge of the distal spring finger section and also to provide rigidity to the distal spring finger section. The gasket base plate includes through holes lining up with through holes in the bulk head base plate when the gasket is snap fitted with the bulk head. The dimensions of the gasket base plate and bulk head base plate can be varied to fit variably sized ports.
REFERENCES:
patent: 5233507 (1993-08-01), Gunther et al.
patent: 5317105 (1994-05-01), Weber
patent: 5513996 (1996-05-01), Annerino et al.
Abolitz Sarah
Koken Michael Alan
Ledynh Bot L.
Ngo Hung V.
Silicon Graphics Inc.
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