Bulk acoustic wave resonator and manufacturing method...

Wave transmission lines and networks – Coupling networks – Electromechanical filter

Reexamination Certificate

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C333S191000, C310S324000

Reexamination Certificate

active

11067374

ABSTRACT:
A bulk acoustic wave resonator in which the problem of the technology for forming the diaphragm structure is resolved, which is more compact and improved the frequency accuracy, and the manufacturing method thereof, a filter using the same, a semiconductor integrated circuit device using the same, and a high frequency module using the same are provided. The bulk acoustic wave resonator according to the present invention comprises a substrate having a first surface and a second surface opposite to the first surface, and a staked resonator including a first electrode film in contact with the first surface, a piezoelectric film overlaying the first electrode film and a second electrode film overlaying the piezoelectric film. The substrate is provided with an air gap including a first aperture opening at the first surface and a second aperture opening at the second surface at the position corresponding to the staked resonator, respectively and having air gap generally vertical shape to the first surface, and another air gap having a tapered shape in the vicinity of the first surface.

REFERENCES:
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patent: 5965970 (1999-10-01), Takeuchi et al.
patent: 6060818 (2000-05-01), Ruby et al.
patent: 6457221 (2002-10-01), Park
patent: 6734763 (2004-05-01), Nishihara et al.
patent: 7053456 (2006-05-01), Matsuo
patent: 60-189307 (1984-03-01), None
patent: 2000-69594 (1999-06-01), None
patent: 2003-204239 (2002-01-01), None
R. Ruby et al., “Micromachined Thin Film Bulk Acoustic Resonators”, 1994 IEEE International Frequency Control Symposium, pp. 135-138.
T. Nishihara et al, “High Performance and Miniature Thin Film Bulk Acoustic Wave Filters for 5 GHz”, 2002 IEEE International Ultrasonics Symposium, pp. 969-972.

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