Building wall panels and method of making the same

Details Building wall panels and method of making the same Building wall panels and method of making the same

1980-07-28

1982-12-28

Thibodeau, Paul J.

Stock material or miscellaneous articles

Sheet, web, or layer weakened to permit separation through...

52526, 52527, 52555, 52558, 264284, 428 50, 428151, 428156, 144347, 144345, E04D 126, E04D 330

Patent

active

043661971

ABSTRACT:
An exterior, deep embossed, shingle lap siding system for building well and roof structures comprising rectangular building panels having a decorative outer weather resistant surface embossed to resemble, when assembled, a plurality of rows of shingle elements laid side-by-side, said weather resistant outer surface including a lower edge portion projecting downwardly below the upper edge portion of the next subjacent row and having an irregular lower edge embossed to resemble the lower edges of a row of variable length shingles placed side-by-side. A method for making said rectangular building panels includes the steps of deep embossing a plurality of rows of said shingle elements on an integral sheet of pressed wood fibers or other suitable building material, the forming of a discontinuity of irregular appearance between adjacent rows and reducing the thickness of the lower edge of each row to separate the adjacent rows while providing an area of reduced thickness for overlapping adjacent rows of said building panels.

REFERENCES:
patent: 3796586 (1974-03-01), Hanlon et al.
patent: 3868300 (1975-02-01), Wheeler
patent: 4279106 (1981-07-01), Gleason et al.

Affiliated with

Also associated with

Rating

Building wall panels and method of making the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Building wall panels and method of making the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Building wall panels and method of making the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1337341