Building module for a ceiling

Heat exchange – With repair or assembly means

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 49, 219345, F28F 700, F24H 908

Patent

active

042057191

ABSTRACT:
A building module for a ceiling having heating elements incorporated therein. The module has the form of a closed unit which can be individually mounted and removed and which comprises a frame and plates arranged on two opposite sides thereof. Heat-emitting elements are protectively arranged in the space defined by said frame and said plates and element connecting means are accessible from outside the unit and are arranged, when a unit is mounted together with other similar units to permit the elements to be connected to the intended supply source via other units located between the source and said one unit. The unit is so constructed that when mounting the same in position adjacent a similar unit there is formed a downwardly open channel between the units which channel is intended to be closed by means of a separate cover member.

REFERENCES:
patent: 2591168 (1952-04-01), Latham et al.
patent: 3143637 (1964-08-01), Rifenbergh
patent: 3260835 (1966-07-01), Soukey et al.
patent: 3277273 (1966-10-01), Williams
patent: 3323582 (1967-06-01), Armstrong
patent: 3603764 (1971-09-01), Martin

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Building module for a ceiling does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Building module for a ceiling, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Building module for a ceiling will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-712536

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.