Buffer zone for the prevention of metal migration

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material

Reexamination Certificate

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C257S513000, C438S404000

Reexamination Certificate

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10974403

ABSTRACT:
Particle migration, such as silver electro-migration, on a flat ceramic surface is effectively eliminated by an upward vertical barrier formed on the surface or a groove formed in the surface between two silver conductors.

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