Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2005-03-01
2005-03-01
Rachuba, M. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S287000, C451S390000, C073S865800
Reexamination Certificate
active
06860790
ABSTRACT:
An apparatus is provided for supporting semiconductor wafer in a wafer processing system. The apparatus comprises at least two wafer support assemblies, defining respectively at least two wafer support levels and being mounted between opposing support beams; one or more supporting bases connected to or integral with each of the wafer support assemblies; and a motion unit coupled to the support beams.
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Equipe Technologies, DBM 2400 Series Robots for 300mm Wafers—Technical Literature (1 page).
Cybec Systems, Per4Mer 6100 Robot—Technical Literature(1 page).
Berkowitz Marvin C.
Nath & Associates PLLC
NOVA Measuring Instruments Ltd.
Rachuba M.
Richmond Derek
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