Buffer system for a wafer handling system

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

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Details

C451S287000, C451S390000, C073S865800

Reexamination Certificate

active

06860790

ABSTRACT:
An apparatus is provided for supporting semiconductor wafer in a wafer processing system. The apparatus comprises at least two wafer support assemblies, defining respectively at least two wafer support levels and being mounted between opposing support beams; one or more supporting bases connected to or integral with each of the wafer support assemblies; and a motion unit coupled to the support beams.

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Equipe Technologies, DBM 2400 Series Robots for 300mm Wafers—Technical Literature (1 page).
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