Buffer shaping device

Chemistry: electrical and wave energy – Apparatus – Electrophoretic or electro-osmotic apparatus

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204458, 204466, 204608, G01N 2726, G01N 27447

Patent

active

055186041

ABSTRACT:
Electrophoresis apparatus with a gel support configured and arranged to hold a gel, a buffer chamber configured and arranged to hold a buffer, with the buffer contacting each end of the gel, and a buffer shaper configured to be positioned near the gel support and in contact with the buffer. The buffer shaper is positioned nearer to one portion of the gel support than to another portion of the gel support to cause the depth of buffer between the gel support and the buffer shaper to vary along the length or width of the gel support and buffer shaper.

REFERENCES:
patent: 3129158 (1964-04-01), Raymond et al.
patent: 3616456 (1971-10-01), Valmet
patent: 3932263 (1976-01-01), Brefka
patent: 4579693 (1986-03-01), Kreisher et al.
patent: 4729823 (1988-03-01), Guevara, Jr.
patent: 4762743 (1988-08-01), von Alven et al.
patent: 4834854 (1989-05-01), Sugihara et al.
patent: 4844786 (1989-07-01), Sugihara et al.
patent: 4904366 (1990-02-01), Tokita et al.
patent: 5190629 (1993-03-01), Sugihara et al.
W. Ansorge and S. Labeit "Field Gradients Improve Resolution on DNA Sequencing Gels" Journal of Biochemical and Biophysical Methods, 10 (3-4), (1984) 237-43.
Anders Olsson et al, "Uniformly Spaced Banding Pattern in DNA Sequencing Gels by use of Field Strength Gradient" Journal of Biochemical and Biophysical Methods, 10 (1-2), (1984), 83-90.
M. D. Biggin et al. "Buffer Gradient Gels and .sup.35 S Label as an Aid to Rapid DNA Sequence Determination" Proceeding of the National Academy of Science, USA, vol. 80 (Jul. 1983) 3963-3965.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Buffer shaping device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Buffer shaping device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Buffer shaping device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2035218

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.