Buffer layers on rolled nickel or copper as superconductor subst

Details Buffer layers on rolled nickel or copper as superconductor subst Buffer layers on rolled nickel or copper as superconductor subst

1998-06-12

2000-11-21

Turner, Archene

Stock material or miscellaneous articles

Composite

Of metal

428469, 428697, 428699, 428701, 428702, B32B 900

Patent

active

061500348

ABSTRACT:
Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y.sub.2 O.sub.3 /Ni, YSZ/Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /CeO.sub.2 /Ni, RE.sub.2 O.sub.3 /Ni (RE=Rare Earth), and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Ni, Y.sub.2 O.sub.3 /Cu, YSZ/Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /CeO.sub.2 /Cu, RE.sub.2 O.sub.3 /Cu, and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approach, which includes chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.

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patent: 5968877 (1999-10-01), Budai et al.
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X.D. Wu, S. R. Foltyn, P. Arendt, J. Townsend, C. Adams, I.H. Campbell, P. Tiwari, Y. Coulter and D.E. Peterson, Appl. Phys. Lett.65 (15) Oct. 10, 1994, P. 1961.
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U.S. application No. 09/096559, Paranthaman et al., filed Jun. 12, 1998.

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