Buffer layers on metal surfaces having biaxial texture as superc

Details Buffer layers on metal surfaces having biaxial texture as superc Buffer layers on metal surfaces having biaxial texture as superc

1998-10-16

2000-12-12

Turner, Archene

Stock material or miscellaneous articles

Composite

Of metal

428469, 428697, 428699, 428701, 428702, B32B 900

Patent

active

061596108

ABSTRACT:
Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y.sub.2 O.sub.3 /Ni, YSZ/Y.sub.2 O.sub.3 /Ni, RE.sub.2 O.sub.3 /Ni, (RE=Rare Earth), RE.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Ni, RE.sub.2 O.sub.3 /CeO.sub.2 /Ni, and RE.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Ni, Y.sub.2 O.sub.3 /Cu, YSZ/Y.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Cu, RE.sub.2 O.sub.3 /CeO.sub.2 /Cu, and RE.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approaches, which include chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.

REFERENCES:
patent: 5741377 (1998-04-01), Goyal et al.
patent: 8670871 (1996-06-01), Budai et al.
patent: 9096559 (1998-06-01), Paranthaman et al.
X.D. Wu, S. R. Foltyn, P. Arendt, J. Townsend, C. Adams, I.H. Campbell, P. Tiwari, Y. Coulter and D.E. Peterson. Appl. Phys. Lett. 65 (15) Oct.10, 1994, p. 1961.
M. Paranthaman et al. Physica C 275 (1997) 266-272 (No Month).
U.S. application No. 08/670,871, Budai et al., Jun. 1996.
U.S. application No. 09/096,559, Paranthaman et al., filed Jun. 1998.
P. Tiwari, Y. Coulter and D. E. Peterson, Appl. Phys. Lett.65 (15) Oct. 10 1994, p. 1961.

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