Bubble monitor for semiconductor manufacturing

Details Bubble monitor for semiconductor manufacturing Bubble monitor for semiconductor manufacturing

1998-03-03

2000-01-11

Breneman, Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

34082506, C23F 102

Patent

active

06013156&

ABSTRACT:
Apparatus for monitoring the hydrogen peroxide concentration in a sulfuric acid bath used to remove photoresist from semiconductor wafers uses the amount of bubbles in the fluid mixture to signal the addition of hydrogen peroxide. The bubbles are directly related to the hydrogen peroxide in sulfuric acid mixture. The bubbles are sensed by a light source and photoelectric sensor connected to a threshold adjustment control which controls a metering solenoid valve to add hydrogen peroxide from a reservoir to the bath when the bubbles decrease.

REFERENCES:
patent: 5439569 (1995-08-01), Carpio

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