Bubble memory package with thermal control

Details Bubble memory package with thermal control Bubble memory package with thermal control

1978-08-11

1980-04-15

Moffitt, James W.

Static information storage and retrieval

Magnetic bubbles

Disposition of elements

G11C 504

Patent

active

041986873

ABSTRACT:
A package of bubble memory components including magnetic bubble memory chips or modules disposed between bias magnets for maintaining and establishing bubbles in said chips, field drive coils for propagating the bubbles established in the chips and thermal management means for stabilizing and dissipating the heat generated within the package including heat conductor means disposed adjacent to the drive coils for conducting heat therefrom and flexible heat conductor means also disposed adjacent the drive coils and flexed, sometimes folded back, toward other components of the package to control the heat of these other components thus stabilizing the temperature of the components with respect to the heat generated by the drive coils.

REFERENCES:
patent: 4096581 (1978-06-01), Carlo et al.
patent: 4101970 (1978-07-01), Saito et al.

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