Bubble memory conductor pattern with heat sink

Details Bubble memory conductor pattern with heat sink Bubble memory conductor pattern with heat sink

1981-02-17

1983-11-22

Moffitt, James W.

Static information storage and retrieval

Magnetic bubbles

G11C 1908

Patent

active

044173237

ABSTRACT:
A micro-pattern element has a heat discharge pattern formed on a fine line portion of a conductor pattern. Breakage caused by temperature elevation of the conductor pattern in response to the application of an electric current and resulting electromigration can be effectively prevented by the heat-discharge pattern formed on the fine line portion of the conductor pattern; thus, the reliability of the micro-pattern element can be remarkably improved.

REFERENCES:
patent: 4073561 (1978-02-01), Baranowski
patent: 4334290 (1982-06-01), Hiroshima et al.
IBM Technical Disclosure Bulletin, vol. 12, No. 10, Mar. 1970, p. 1665.

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