Brush for scrubbing semiconductor wafers

Brushing – scrubbing – and general cleaning – Machines – Wiping

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Details

15 971, 15230, 1523016, 152441, 451530, B08B 104, B08B 300, B08B 1100

Patent

active

058707930

ABSTRACT:
A tool for cleaning semiconductor wafers includes a cleaning head with a flat face bounded by an edge. A tubular drive shaft is connected to the cleaning head and provides a conduit through which a cleaning fluid can flow. An opening into the shaft is provided in the flat face which also has a plurality of channels to distribute the cleaning fluid across the flat face. A brush is formed as a single piece of porous, elastic material with a substrate portion that has a first major surface abutting the cleaning head face. A lip of the brush extends from the substrate portion around the edge of the flat face to removably secure the brush to the cleaning head. The brush has a plurality of cylindrical nubs on the second major surface forming projections for scrubbing surfaces of semiconductor wafers.

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