Cleaning and liquid contact with solids – Processes – Using solid work treating agents
Reexamination Certificate
2000-01-11
2001-12-18
Carrillo, Sharidan (Department: 1746)
Cleaning and liquid contact with solids
Processes
Using solid work treating agents
C134S002000, C134S042000, C134S902000, C029S895210, C029S895230, C029S450000, C015S179000, C015S230000, C015S230140, C015S230160, C015S230180
Reexamination Certificate
active
06331213
ABSTRACT:
FEDERALLY SPONSORED RESEARCH
Not Applicable
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a brush alignment platform and, more particulary, to an alignment jig that provides for the disposition of a brush on a roller, in static alignment, by creating a layer of fluid beneath the brush to successively unseat the brush from the roller and bring the brush substantially into static alignment a
2. Description of the Invention Background
As is known in the art, in the course of the process of manufacturing a semiconductor device, impurities will become deposited on the surface of the semiconductor wafer or substrate. If these contaminants are allowed to remain in the wafer throughout the manufacturing process, the quality and the yield of the production process will be negatively affected. Therefore, various cleaning processes are typically employed throughout the manufacturing process in an attempt to eliminate these impurities from the surface of the semiconductor.
One such known cleaning apparatus includes rotating a substantially cylindrical brush, having a plurality of cleaning tips thereon, along the surface of the semiconductor to remove impurities. In practice, the brush has a length equal to or greater than the diameter of the wafer to be cleaner The cylindrical brush is manually seated onto a roller shaft. The shaft is then mechanically rotated about its axis while being moved along a diameter of the wafer. In the alternative, the wafer itself is also rotated about its center point while the brush is rotated about its axis. In either case, the cleaning tips are brought into contact with the surface of the wafer while a cleaning solution is introduced onto the surface of the wafer. As such, the entire surface of the wafer is contacted and
cleaned by the rotating action of the cleaning tips. As described, the cleaning apparatus can be employed to clean either the top or bottom side of the semiconductor wafer. Such wafer cleaning apparatus are known in the art by and sold under the trademark of On-Trak™ by OnTrak Systems, Inc of Milpitas, Calif.
In such a cleaning apparatus, for the brush to successfully clean the surface of the wafer, it is critical that the brush be evenly disposed along the length of the roller shaft so that the cleaning tips are evenly aligned throughout the surface of the brush. However, due to the need for the brush to be in close communication with the surface of the roller, the inner diameter of the brush is designed to be equal to or less than the outer diameter of the roller. Therefore, it is necessary to manually deform and stretch the brush to fully seat it onto the roller. Manual application of the brush is very difficult to accomplish without twisting and unevenly disposing the brush along the shaft. Such a misalignment of the brush creates an uneven placement of the cleaning tips about the surface area of the brush which ultimately leads to an uneven cleaning of the surface of the wafer by the brush. The most common method of aligning the brush is to manually re-seat it onto the shaft. This method involves applying and aligning the brush by hand. Typically, it is time consuming and only partially effective.
Increasing the inner diameter of the brush will decrease the tendency for the brush to be unevenly disposed along the shaft. However, increasing the diameter of the brush will also decrease the frictional contact between the brush and the shaft. This typically leads to slippage between the brush and the roller which causes premature wearing of the brush and uneven cleaning of the wafer. Thus, increasing the diameter of the brush to eliminate this problem is undesirable. Other methods designed to reduce the misalignment of the brush on the shaft, such as lubricating the points of contact between the brush and the shaft, also lead to such slipping and are thus equally undesirable
Thus, the only suitable method known in the art-of aligning the brush on the roller is to do so by hand. This manual alignment process is typically slow, cumbersome and only partially effective. None of the known cleaning apparatus in the prior art provide an adequate solution to the problem of proper brush alignment.
The subject invention is thus directed toward a brush alignment apparatus and method which addresses, among others, the above-discussed needs and provides an apparatus and method for aligning a cleaning brush on a roller such that it is evenly disposed about the entire surface area of the shaft with minimal effort and time expended by the operator.
SUMMARY OF THE INVENTION
The present invention provides a brush alignment apparatus and method for installing brushes onto a roller in a uniformly disposed manner. This invention also provides a brush alignment apparatus and method that allows for the installation of brushes onto rollers with decreased effort and time expended on the part of the operator. Further, the instant invention serves to provide a brush alignment apparatus and method that provides for improved operation and performance of the brush.
In accordance with a preferred form of the present invention, there is provided a brush alignment apparatus and jig. The brush alignment apparatus and jig disclosed herein includes a roller having a internal cavity running therethrough and a plurality of orifices disposed about the outer surface of the roller that allow for fluid communication between the internal cavity and outer the surface of the roller. A source of pressurized fluid is provided in communication with the internal cavity, such that when a brush is disposed upon the roller and fluid is fed into the internal cavity, the fluid will flow through the plurality of orifices and create a layer of fluid between the outer surface of the roller and the inner surface of the brush. The rate at which the liquid or gas is fed through the cylinder is sufficient to distend the brush so that it is no longer substantially separated frictional communication with the outer surface of the roller and is substantially, separated from the roller by the layer of fluid While supported by this layer, the brush will return to its natural aligned state. When the flow of fluid is terminated, the layer of fluid between the outer surface of the roller and the inner surface of the brush becomes insufficient to support the distended brush and the brush contracts to again contact the outer surface of the roller. Though the brush is again in contact with the roller, the brush remains in its natural aligned state.
Accordingly, the present invention provides solutions to the problems associated with existing rollers and roller jigs. The reader will appreciate that these and other details, objects and advantages will become apparent as the following detailed description of the present preferred embodiments thereof proceeds or may be learned from practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly set forth in the appended claims.
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Brunelli Shon
Kennedy Timothy
Ludwig Bryan
Carrillo Sharidan
Kirkpatrick & Lockhart LLP
Micro)n Technology, Inc.
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