Broadband transition from a via interconnection to a planar...

Wave transmission lines and networks – Coupling networks – With impedance matching

Reexamination Certificate

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Details

C333S034000

Reexamination Certificate

active

08085112

ABSTRACT:
According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; the length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.

REFERENCES:
patent: 7492146 (2009-02-01), Behziz
patent: 2006/0197625 (2006-09-01), Kashiwakura
patent: 05-102667 (1993-04-01), None
patent: 05-199019 (1993-08-01), None
patent: 06-302964 (1994-10-01), None
patent: 08-250912 (1996-09-01), None
patent: 2003-031945 (2003-01-01), None
patent: 2003-218481 (2003-07-01), None
patent: 2004-363276 (2004-12-01), None
patent: 2004-363975 (2004-12-01), None
patent: 2006-245291 (2006-09-01), None
patent: 01/67538 (2001-09-01), None

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