Broadband tight coupled microstrip line structures

Wave transmission lines and networks – Plural channel systems – Having branched circuits

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333238, H01P 518

Patent

active

053131754

ABSTRACT:
A coupled line structure for microwave signals employs a gallium-arsenide substrate having an embedded metallic line located on a surface of the substrate. The surface of the substrate is covered with a thin dielectric layer and at least another metallic line is positioned on the dielectric layer and parallel to the embedded line with a portion of the lines overlapping one another for coupling. A third line can also be disposed on the dielectric layer which line is parallel to the other lines and where the embedded line is connected by a via hole to one of the lines on the dielectric.

REFERENCES:
patent: 3500255 (1970-03-01), Ho et al.
patent: 3560891 (1971-02-01), MacLeay et al.
patent: 3644850 (1972-02-01), Ho
patent: 5008639 (1991-04-01), Pavio

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