Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor
Patent
1984-10-12
1987-08-25
Eisenzopf, Reinhard J.
Electricity: measuring and testing
Measuring, testing, or sensing electricity, per se
With rotor
324158F, 439260, G01R 3126, H01P 500
Patent
active
046895566
ABSTRACT:
A contactor assembly for testing electronic devices that are packaged with a dual-in-line pin array has an insulating base that mounts two rows of contacts, each adapted to flex into electrical connection with a pin of the device, and a pair of flexible ground planes each spaced closely from an associated one row of said contacts. A flexible, insulating spacer maintains the ground planes and their associated row of contacts with a substantially fixed spacing there between during the flexural movement of said contacts. In the preferred form, the upper edge of the ground planes adjacent the pins includes an arrangement for securing a chip electornic device, a capacitor or a resistor. The other end of the chip mounts a contact tip that makes electrical connection with an associated pin when the associated contact also connects with the pin. The signal path provided by the holder, chip and tip is extremely short, preferably less than 0.150 inch. The contacts and ground planes electrically surface mount on a contactor board. Flexible lower end portions of the contacts and ground planes make direct electrical connection with signal pads and ground planes on the board without the use of connectors. A flexible mount formed by strips of a conductive material having arms soldered to two or more contacts hold a surge capacitor that decouples the device from ground noise during large current surges.
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Valentine, E. et al., "Conductive Epoxy Encapsulated Wafer Probe", IBM Technical Disclosure Bulletin, vol. 20, No. 11B, Apr. 1978, pp. 4797-4798.
Fineran, W. et al., "Test Socket for Use Where Electrical Interference is Critical", IBM Technical Disclosure Bulletin, vol. 17, No. 6, Nov. 1974, p. 1626.
Bry, A., et al., "Bypass Capacitor for Chip Probe", IBM Techincal Disclosure Bulletin, vol. 18, No. 11, Apr. 1976, p. 3629-3630.
Motorola Semiconductors Brochure, MC12071/CA3179, undated.
Baker Stephen M.
Daymarc Corporation
Eisenzopf Reinhard J.
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