Brittle material rotating and aligning mechanism for use in...

Severing by tearing or breaking – Breaking or tearing apparatus – Combined with preliminary weakener or with nonbreaking cutter

Reexamination Certificate

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Details

C225S103000, C225S093000, C125S023010, C083S879000

Reexamination Certificate

active

06892917

ABSTRACT:
A brittle material rotating and aligning mechanism including a bearing, a rotary table, and a driving mechanismU, and installed in the worktable of a brittle material scribing and breaking apparatus; carries brittle material, for example, a semiconductor wafer for scribing and breaking into individual dies. The driving mechanism uses a flexible transmission member to rotate the rotary table for low installation cost, no requirement for a precision adjustment during installation, and, preventing the occurrence of back lash or the production of particles due to friction between the transmission member and the driving wheel of the driving mechanism, or between the transmission member and the rotary table.

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patent: 20040080730 (2004-04-01), Binnard

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