Brittle fracture resistant spring

Details Brittle fracture resistant spring Brittle fracture resistant spring

2007-09-07

2010-02-02

Zarroli, Michael C (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

C439S066000, C029S874000

Reexamination Certificate

active

07654833

ABSTRACT:
A spring contact has a post-release outer upper surface in compression and a post-release outer lower surface in compression. A compressive lower layer of spring material may be formed at a thickness that is three-eighths or less of a tensile upper layer of spring material. A low modulus of elasticity cladding material may also be applied to the outer surface of the spring contact with a lower surface of the cladding material being formed with a compressive stress.

REFERENCES:
patent: 5613861 (1997-03-01), Smith et al.
patent: 6528350 (2003-03-01), Fork
patent: 6827584 (2004-12-01), Mathieu et al.
patent: 6973722 (2005-12-01), Hantschel et al.
patent: 7048548 (2006-05-01), Mathieu et al.
patent: 2006/0030179 (2006-02-01), Van Schuylenbergh et al.

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