Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-10-09
2007-10-09
Zarroli, Michael C. (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C438S106000, C438S117000
Reexamination Certificate
active
11347740
ABSTRACT:
A spring contact has a post-release outer upper surface in compression and a post-release outer lower surface in compression. A compressive lower layer of spring material may be formed at a thickness that is three-eighths or less of a tensile upper layer of spring material. A low modulus of elasticity cladding material may also be applied to the outer surface of the spring contact with a lower surface of the cladding material being formed with a compressive stress.
REFERENCES:
patent: 5613861 (1997-03-01), Smith et al.
patent: 6528350 (2003-03-01), Fork
patent: 6827584 (2004-12-01), Mathieu et al.
patent: 7048548 (2006-05-01), Mathieu et al.
patent: 2006/0030179 (2006-02-01), Van Schuylenbergh et al.
Fork David K.
Hantschel Thomas
Palo Alto Research Center Incorporated
Zarroli Michael C.
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